This self-contained book gives fundamental knowledge about scattering and diffraction of electromagnetic waves and fills the gap between general electromagnetic theory courses and collections of engineering formulas. The book is a tutorial for advanced students learning the mathematics and physics of electromagnetic scattering and curious to know how engineering concepts and techniques relate to the foundations of electromagnetics
Dedicated to a complete presentation on all aspects of reverberation chambers, this book provides the physical principles behind these test systems in a very progressive manner. The detailed panorama of parameters governing the operation of electromagnetic reverberation chambers details various applications such as radiated immunity, emissivity, and shielding efficiency experiments. In addition, the reader is provided with the elements of electromagnetic theory and statistics required to take full advantage of the basic operational rules of reverberation chambers, including calibration procedures. Comparisons with other testing systems (TEM cells, anechoic chambers) are also discussed.
The first book to focus on the electromagnetic basis of signal integrity The Foundations of Signal Integrity is the first of its kind—a reference that examines the physical foundation of system integrity based on electromagnetic theory derived from Maxwell's Equations. Drawing upon the cutting-edge research of Professor Paul Huray's team of industrial engineers and graduate students, it develops the physical theory of wave propagation using methods of solid state and high-energy physics, mathematics, chemistry, and electrical engineering before addressing its application to modern high-speed systems. Coverage includes: All the necessary electromagnetic theory needed for a complete understanding of signal integrity Techniques for obtaining analytic solutions to Maxwell's Equations for ideal materials and boundary conditions Plane electromagnetic waves Plane waves in compound media Transmission lines and waveguides Ideal models vs. real-world systems Complex permittivity of propagating media Surface roughness Advanced signal integrity Signal integrity simulations Problem sets for each chapter With its thorough coverage of this relatively new discipline, the book serves as an ideal textbook for senior undergraduate and junior graduate students, as well as a resource for practicing engineers in this burgeoning field. At the end of each section, it typically stimulates the reader with open-ended questions that might lead to future theses or dissertation research.
Dealing with vibrations and waves, this text aims to provide understanding of the basic principles and methods of analysing various physical phenomena. The content includes the general properties of propagation, a detailed study of mechanical (elastic and acoustic) and electromagnetic waves, propagation, attenuation, dispersion, reflection, interference and diffraction of waves. It features chapters on the effect of motion of sources and observers (both classical and relativistic), emission of electromagnetic waves, standing and guided waves and a final chapter on de Broglie waves constitutes an introduction to quantum mechanics.
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.